VPG+ 200
VPG+400

VPG+ 800
VPG+1400

ULTRA

專業光罩製版系統
大型光罩製版系統
半導體產業光罩生產設備

THE MULTI-PURPOSE VOLUME PATTERN GENERATORS
光學系統上的創新與突破-平行化曝光技術製版系統

LARGE–AREA VOLUME PATTERN GENERATORS
大尺寸光罩和顯示器生產工具

THE SEMICONDUCTOR LASER MASK WRITER
PSM 二次套刻解決方案

VPG+ 200和VPG+400非常適合生產光罩以及對應i-line光刻膠,例如SU-8和IP3600的應用,超高速曝光引擎和自動對準能力共同為系統提供卓越的解析度、優秀的影像品質和快速的吞吐量。

VPG+ 200和400系列對於較小曝光區域的典型應用,包括微機電系統(MEMS)、先進封裝、3D集成、LED生產和化合物半導體等領域。

Our Multi-Purpose Volume Pattern Generators are perfectly suited for the production of standard photomasks as well as for i-line resist applications. An ultra-high-speed exposure engine and automated alignment capability both contribute to systems that excel through high resolution, outstanding image quality, and fast throughput.

Our VPG+ 200 and 400 systems present a perfect solution for applications that use i-line resists such as SU-8 and IP 3600, for example for rapid prototyping applications in microfluidics. In combination with their high speed and resolution, the VPG+ 200 and 400 therefore provide an excellent alternative to an i-line stepper.

Typical applications for the smaller exposure area members of the VPG+ family include such demanding fields as MEMS, advanced packaging, 3D integration, LED production, and compound semiconductors.

我們的大尺寸+系統非常適合用於先進封裝、半導體、顯示器、彩色濾光片、LED和觸控面板等應用的光罩製作。系統支援所有工業數據格式,並提供Mura優化功能,確保優秀的CD均勻性和解析度,封閉環境室符合最嚴格的高級光罩技術使用的要求。由於速度快、系統價格具有吸引力且運行成本低,大尺寸VPG+系列是大尺寸光罩應用中最具生產力的解決方案。

VPG+ 1400是我們最大的系統,尤其適用於顯示器領域的應用,如TFT陣列、彩色濾光片和ITO,並具有特別強大的環境室、分差干涉儀,分辨率高達1.2nm,以及先進的Mura校正能力。

Our Large Area VPG+ systems are perfectly equipped for applications such as photomask fabrication for advanced packaging, semiconductors, displays, color filters, LEDs, and touch panel applications. The systems support all industrial data formats and offer Mura optimization functions ensuring excellent CD uniformity and resolution. The closed-loop environmental chambers comply with the most stringent requirements for use in advanced photomask technology. Because of their speed, attractive system price, and low running costs, the Large Area VPG+ series represents the most productive solution for large area photomask applications.

The VPG+ 1400 is our largest system and particularly aimed at applications in the display industry: FPD applications like TFT-arrays and color filters, and ITO. The VP+ 1400 features a particularly powerful environmental chamber, a differential interferometer with a resolution down to 1.2 nm, and advanced Mura correction capabilities.

ULTRA系統針對半導體產業製造光罩,提供了經濟實惠的雷射直寫生產光罩方案,擁有高通量、高精度和結構均勻性,以及極其精確的對準功能。由於其現代化、緊湊的結構,您可以輕鬆將系統整合到現有的光罩製造基礎設施中。

現今,光罩在半導體器件製造中仍然是重要的組成環節,被廣泛應用在電源、微控制器、LED照明、物聯網、微機電、汽車工業等領域。 ULTRA系統支持結構尺寸低於500nm,速度最快高達每分鐘325 mm²或580 mm²(取決於寫入模式),同時具有優秀的均勻性、高品質圖像、多層套刻精度以及重複定位精度。

The ULTRA specifically addresses the production of mature semiconductor photomasks. It provides an economical mask writer solution with all the features you require for high throughput, high precision and structure uniformity, and extremely accurate alignment. With its modern, compact build, you can easily incorporate the system into an existing mask shop infrastructure.

Mature photomasks continue to be a vital component in semiconductor device fabrication, being used in power management, microcontrollers, LED lighting, the IOT, MEMS, the automotive industry, to name but a few. The ULTRA serves this market with structure sizes down to 500 nm and write speeds up to 325 mm2 or 580 mm2 per minute depending on write mode, while featuring excellent values for CD, image quality, overlay, and registration.

KEY FEATURES

Maximum substrate size: 8” (VPG+ 200) and 16” (VPG+ 400) respectively Minimum feature size: Down to 0.75 μm Address grid: Down to 12.5 nm Maximum write speed (at structure size 4 um): 13500 mm²/min Exchangeable write modes Real-time autofocus system High power DPSS laser with 355 nm wavelength Camera system for metrology and alignment Closed-loop climate chamber Automatic substrate loading system Stage map correction Edge detector system Multiple data input formats (DXF, CIF, GDSII and Gerber)

Maximum substrate size: 800 x 800 mm² / 1100 x 1100 mm² / 1400 x 1400 mm² Minimum feature size: Down to 0.75 μm Maximum write speed (at 4 μm feature size): 16500 mm² / min Real-time autofocus system High power DPSS laser with 355 nm Camera system for metrology and alignment Closed-loop environmental chamber Automatic substrate loading system Stage map correction Mura correction Edge detector system Multiple data input formats (DXF, CIF, GDSII and Gerber files)

Maximum substrate size: 9" x 9"; optional: 17" x 17" Minimum feature size: 500 nm Address grid down to 5 nm High-speed optical engine Customized UV optics (0.9 NA objective lens) 20 nm line edge roughness Input formats: All standard formats, e.g. GDSII, OASIS Overlay of 30 nm Economical, high-power UV laser 100 nm 2nd layer alignment Automatic mask loader CD uniformity of 30 nm SECS / GEM protocol High-speed data path for all types of pattern

Application

Micro-optics MEMS Display Micro sensor

Micro-optics MEMS Display Micro sensor

Micro-optics MEMS Display Micro sensor