VPG+200
VPG+400/VPG+800

VPG+1400 FPD

VPG 300 DI

專業光罩製版系統
大型光罩製版系統
先進雷射直寫圖型發生器

THE MULTI-PURPOSE VOLUME PATTERN GENERATORS
光學系統上的創新與突破-平行化曝光技術製版系統

LARGE–AREA VOLUME PATTERN GENERATORS
大尺寸光罩和顯示器生產工具

THE MASKLESS DIRECT IMAGER VPG 300 DI
FOR HIGH ACCURACY AND HIGH RESOLUTION MICROSTRUCTURES
快速展現高精度、高分辨率的微型結構

VPG+ 200和VPG+400非常適合生產光罩以及對應i-line光刻膠,例如SU-8和IP3600的應用,超高速曝光引擎和自動對準能力共同為系統提供卓越的解析度、優秀的影像品質和快速的吞吐量。

VPG+ 200和400系列對於較小曝光區域的典型應用,包括微機電系統(MEMS)、先進封裝、3D集成、LED生產和化合物半導體等領域。

Our Multi-Purpose Volume Pattern Generators are perfectly suited for the production of standard photomasks as well as for i-line resist applications. An ultra-high-speed exposure engine and automated alignment capability both contribute to systems that excel through high resolution, outstanding image quality, and fast throughput.

Our VPG+ 200 and 400 systems present a perfect solution for applications that use i-line resists such as SU-8 and IP 3600, for example for rapid prototyping applications in microfluidics. In combination with their high speed and resolution, the VPG+ 200 and 400 therefore provide an excellent alternative to an i-line stepper.

Typical applications for the smaller exposure area members of the VPG+ family include such demanding fields as MEMS, advanced packaging, 3D integration, LED production, and compound semiconductors.

我們的大尺寸+系統非常適合用於先進封裝、半導體、顯示器、彩色濾光片、LED和觸控面板等應用的光罩製作。系統支援所有工業數據格式,並提供Mura優化功能,確保優秀的CD均勻性和解析度,封閉環境室符合最嚴格的高級光罩技術使用的要求。由於速度快、系統價格具有吸引力且運行成本低,大尺寸VPG+系列是大尺寸光罩應用中最具生產力的解決方案。

VPG+ 1400是我們最大的系統,尤其適用於顯示器領域的應用,如TFT陣列、彩色濾光片和ITO,並具有特別強大的環境室、分差干涉儀,分辨率高達1.2nm,以及先進的Mura校正能力。

Our Large Area VPG+ systems are perfectly equipped for applications such as photomask fabrication for advanced packaging, semiconductors, displays, color filters, LEDs, and touch panel applications. The systems support all industrial data formats and offer Mura optimization functions ensuring excellent CD uniformity and resolution. The closed-loop environmental chambers comply with the most stringent requirements for use in advanced photomask technology. Because of their speed, attractive system price, and low running costs, the Large Area VPG+ series represents the most productive solution for large area photomask applications.

The VPG+ 1400 is our largest system and particularly aimed at applications in the display industry: FPD applications like TFT-arrays and color filters, and ITO. The VP+ 1400 features a particularly powerful environmental chamber, a differential interferometer with a resolution down to 1.2 nm, and advanced Mura correction capabilities.

突破光罩的限制、成本和延遲。VPG 300 DI 是一款高性能直寫光刻系統,助您將創新週期從數周縮短至數小時。VPG 300 DI融合傳統i-line步進式光刻機的精度優勢和無光罩工作流程的強大優勢,使研發週期能夠以無與倫比的速度和靈活性,直接在最大 300 毫米的晶片直寫,繪製高解析度微結構圖案。

步進式光刻的精度,直寫技術的自由

VPG 300 DI完美彌合研發與生產的差距。它既具備基於光罩的步進式光刻機所擁有的亞微米級解析度和嚴格套刻精度,又徹底消除了光罩採購帶來的高昂成本與交期延誤。這使它成為快速原型、工藝開發和需要頻繁設計反覆運算需求的理想解決方案。

從 CAD 設計到曝光只需幾分鐘,而不是幾周

VPG 300 DI讓您實現設計構思的即時轉化,將傳統數周週期壓縮至分鐘級別。先進光學引擎支援每日測試新設計,徹底改變加快開發進度。

  • 高速曝光:
    定制的空間光調製器 (SLM) 和優化的資料路徑,使您只需 9 分鐘即可寫入 100×100 mm²的區域。

  • 無縫大面積加工:
    支持無尺寸限制的大面積器件製備,徹底規避步進式光刻固有的拼接誤差。

  • 即時更改設計:
    CAD 檔修改立即開始曝光。無需經歷新光罩訂購、等待、檢查和存儲。

實現卓越的特徵保真度

您的研究需要極致精度。VPG 300 DI基於成熟的VPG+平台打造,配備高穩定性Zerodur®載台,即使是要求最嚴苛的微結構也能提供出色品質。

  • 高解析度:
    穩定製備500納米以下的精細結構。

  • 卓越的邊緣品質:
    邊緣粗糙度< 40 nm (3σ)。

  • 出色的CD均勻性:
    嚴格的工藝控制,CD 均勻度< 50 nm (3σ)。

智慧工具賦能複雜器件製造

從多層MEMS到先進封裝工藝,VPG 300 DI配備精密的系統解決方案,確保整個基板範圍內的完美對準和聚焦。

  • 自動多層對準:
    實現正面對準精度達 100 nm。該系統還支援埋入結構優化設計,支援可見光(VIS)與紅外(IR)雙模式背面對準。

  • 動態自動對焦:
    可選擇光學或氣動自動對焦模式,動態補償晶圓翹曲或形貌變化> 160 µm,確保全域對焦清晰。

  • 綜合計量:
    即時測量位置、關鍵尺寸(CD)及邊緣粗糙度,提供即時的工藝回饋。

  • 環境穩定性:
    帶有軟體補償功能的集成流場控制箱和環境感測器,可確保長期穩定的寫入結果。

準備好突破光罩工藝瓶頸了嗎?

VPG 300 DI將如何革新您的製造流程?請聯繫我們的技術專家,瞭解直寫光刻技術如何加速您的研發突破。

PRODUCT HIGHLIGHTS

Maximum substrate size: 8” (VPG+ 200) and 16” (VPG+ 400) respectively Minimum feature size: Down to 0.75 μm Address grid: Down to 12.5 nm Maximum write speed (at structure size 4 um): 13500 mm²/min Exchangeable write modes Real-time autofocus system High power DPSS laser with 355 nm wavelength Camera system for metrology and alignment Closed-loop climate chamber Automatic substrate loading system Stage map correction Edge detector system Multiple data input formats (DXF, CIF, GDSII and Gerber)

Maximum substrate size: 800 x 800 mm² / 1100 x 1100 mm² / 1400 x 1400 mm² Minimum feature size: Down to 0.75 μm Maximum write speed (at 4 μm feature size): 16500 mm² / min Real-time autofocus system High power DPSS laser with 355 nm Camera system for metrology and alignment Closed-loop environmental chamber Automatic substrate loading system Stage map correction Mura correction Edge detector system Multiple data input formats (DXF, CIF, GDSII and Gerber files)

曝光速度
100×100 mm²區域寫入僅需9分鐘
曝光品質
邊緣粗糙度<40nm,CD 均勻度<50 nm,解析度< 500 nm
對準精度
第二層正面對準精度達 100 nm,背面 VIS / IR ±1 µm
智慧對準系統
全域/局部自動對準及畸變校正;VIS 背面對準;紅外(IR)對準適用於埋入結構
自動對焦
可選光學/氣動對焦模式,動態補償能力> 160 µm
集成計量功能
即時監測位置、CD及邊緣粗糙度
寫入的穩定性
集成環境計量、流場控制箱和軟體修正功能,以補償環境變化

AVAILABLE MODULES

Micro-optics MEMS Display Micro sensor

Micro-optics MEMS Display Micro sensor

Automatic handling options
Open frame handling with SEMI standard carriers and prealigning available for 100 to 200 mm or 200 / 300 mm standard wafers (others on request)
Two write modes to choose from
High NA for highest resolution or lower NA optimized for throughput or DOF critical applications
Alignment options
VIS and IR backside alignment
Service Contracts
Worldwide service level agreements for faster on-site support and access to spare parts