VPG⁺200
VPG⁺400/VPG⁺800

VPG⁺1400 FPD

VPG 300 DI

專業光罩製版系統

大型光罩製版系統

先進雷射直寫圖型發生器

THE MULTI-PURPOSE VOLUME PATTERN GENERATORS
光學系統上的創新與突破-平行化曝光技術製版系統

LARGE–AREA VOLUME PATTERN GENERATORS
大尺寸光罩和顯示器生產工具

THE MASKLESS DIRECT IMAGER VPG 300 DI
FOR HIGH ACCURACY AND HIGH RESOLUTION MICROSTRUCTURES
快速展現高精度、高分辨率的微型結構

VPG⁺ 200和VPG⁺400非常適合生產光罩以及對應i-line光刻膠，例如SU-8和IP3600的應用，超高速曝光引擎和自動對準能力共同為系統提供卓越的解析度、優秀的影像品質和快速的吞吐量。

VPG⁺ 200和400系列對於較小曝光區域的典型應用，包括微機電系統(MEMS)、先進封裝、3D集成、LED生產和化合物半導體等領域。

Our Multi-Purpose Volume Pattern Generators are perfectly suited for the production of standard photomasks as well as for i-line resist applications. An ultra-high-speed exposure engine and automated alignment capability both contribute to systems that excel through high resolution, outstanding image quality, and fast throughput.

Our VPG+ 200 and 400 systems present a perfect solution for applications that use i-line resists such as SU-8 and IP 3600, for example for rapid prototyping applications in microfluidics. In combination with their high speed and resolution, the VPG+ 200 and 400 therefore provide an excellent alternative to an i-line stepper.

Typical applications for the smaller exposure area members of the VPG+ family include such demanding fields as MEMS, advanced packaging, 3D integration, LED production, and compound semiconductors.

我們的大尺寸⁺系統非常適合用於先進封裝、半導體、顯示器、彩色濾光片、LED和觸控面板等應用的光罩製作。系統支援所有工業數據格式，並提供Mura優化功能，確保優秀的CD均勻性和解析度，封閉環境室符合最嚴格的高級光罩技術使用的要求。由於速度快、系統價格具有吸引力且運行成本低，大尺寸VPG+系列是大尺寸光罩應用中最具生產力的解決方案。

VPG⁺ 1400是我們最大的系統，尤其適用於顯示器領域的應用，如TFT陣列、彩色濾光片和ITO，並具有特別強大的環境室、分差干涉儀，分辨率高達1.2nm，以及先進的Mura校正能力。

Our Large Area VPG⁺ systems are perfectly equipped for applications such as photomask fabrication for advanced packaging, semiconductors, displays, color filters, LEDs, and touch panel applications. The systems support all industrial data formats and offer Mura optimization functions ensuring excellent CD uniformity and resolution. The closed-loop environmental chambers comply with the most stringent requirements for use in advanced photomask technology. Because of their speed, attractive system price, and low running costs, the Large Area VPG⁺ series represents the most productive solution for large area photomask applications.

The VPG⁺ 1400 is our largest system and particularly aimed at applications in the display industry: FPD applications like TFT-arrays and color filters, and ITO. The VP⁺ 1400 features a particularly powerful environmental chamber, a differential interferometer with a resolution down to 1.2 nm, and advanced Mura correction capabilities.

VPG 300 DI 是一款專為在 i-line 光刻膠中進行高分辨率的微結構而設計的雷射直寫圖型發生器。源自於光罩製造工具，具備所有先進的 VPG 系統元件，能夠實現最高精度和準確度，其最大寫入區域可覆蓋 300 mm的晶圓。

VPG 300 DI 主要應用領域是學術和工業研究與開發，尤其對於需要高靈活性和小於 2 µm微結構的應用。適用於各種應用的需求，包括產品原型設計、MEMS、與其他工具的混合和匹配，以及具有無縫拼接寫入效果。

VPG 300 DI 的性能與傳統的光罩 i-line 步進式曝光機相當，同時提供無光罩激光直寫技術的優勢。

The VPG 300 DI is a Volume Pattern Generator specially designed for direct writing high-resolution microstructures in i-line resists. Derived from the mask making tool, it features all advanced VPG system components to be able to write with the highest precision and accuracy. The maximum write area covers a 300 mm wafer.

The target usage of the VPG 300 DI system is primarily in academic and industrial research and development, where high flexibility and features smaller than 2 µm are required. This system caters to the needs of various applications, including product prototyping, MEMS, mix and match with other tools, and writing of structures with quasi-stitching-less unlimited die sizes. The VPG 300 DI performance is comparable to a mask-based i-line stepper that is traditionally used for these applications, while providing the advantages of a maskless patterning technology.

KEY FEATURES

Maximum substrate size: 8” (VPG+ 200) and 16” (VPG+ 400) respectively Minimum feature size: Down to 0.75 μm Address grid: Down to 12.5 nm Maximum write speed (at structure size 4 um): 13500 mm²/min Exchangeable write modes Real-time autofocus system High power DPSS laser with 355 nm wavelength Camera system for metrology and alignment Closed-loop climate chamber Automatic substrate loading system Stage map correction Edge detector system Multiple data input formats (DXF, CIF, GDSII and Gerber)

Maximum substrate size: 800 x 800 mm² / 1100 x 1100 mm² / 1400 x 1400 mm² Minimum feature size: Down to 0.75 μm Maximum write speed (at 4 μm feature size): 16500 mm² / min Real-time autofocus system High power DPSS laser with 355 nm Camera system for metrology and alignment Closed-loop environmental chamber Automatic substrate loading system Stage map correction Mura correction Edge detector system Multiple data input formats (DXF, CIF, GDSII and Gerber files)