When components contain congested surface area, PANTHEON's breakouts help automate routing from surface mount components. PANTHEON can generate parametric breakouts automatically and interactively, with access to a variety of via types in breakout geometries, including blind and through-hole vias. Several parametric breakout patterns are available, including wire bond, staggered, routing corridor, and ball grid arrays. PANTHEON has the capability to rotate rectangular vias collinear with the bond wires when the breakout is designed, and even allows breakouts (including wire bond) to be edited automatically at the geometry and board levels, a key advantage to PANTHEON's hybrid functionality. PANTHEON supports multiple breakout geometries for each generic component geometry. Using the parametric breakout generator, preview breakouts using different specifications before placing it on the board. This makes it easy to interactively modify a breakout and see the results immediately. If the specifications are not correct, simply change the parameters and watch PANTHEON instantly update the preview window. Once the breakout is created, it can be saved at the geometry level so that it can be reused.